发明名称 WIRING BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE: To provide a method of manufacturing a wiring board which is higher than a conventional one in reliability. CONSTITUTION: A conductive material 14 which electrically connects wiring layers 11 together is made columnar, whereby the columnar conductive material 14 becomes lower than a conventional hollow conductive material in resistance and inductance, so that heat released from the conductive material 14 can be reduced, and a wiring board of this constitution can be more improved in reliability than a conventional wiring board.
申请公布号 JPH08321684(A) 申请公布日期 1996.12.03
申请号 JP19950150942 申请日期 1995.05.24
申请人 SONY CORP 发明人 ISHIKAWA MINORU
分类号 H05K3/46;H05K1/00;H05K1/02;H05K3/40;(IPC1-7):H05K3/46 主分类号 H05K3/46
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