| 摘要 |
PURPOSE: To easily and surely obtain a multilayer film by supplying at least two kinds of electroless plating soln. alternately on a substrate, by spin plating. CONSTITUTION: A substrate 11 is fixed to the substrate holding mechanism 12 rotated at 1-300r.p.m. by a rotating device 14 when a film is formed, and at least two kinds of electroless plating soln. or the electroless plating soln. and a substitution plating soln. are alternately supplied from plural nozzles 15 and 16 to form a multilayer film on the substrate 11 surface. A mechanism for heating the substrate 11 and the supplied plating soln. is provided to this device. The electroless plating soln. is separated into a metallic salt soln. and a reducing agent soln., and both solns. are separately supplied, mixed on the substrate 11 and subjected to a reaction. The thickness of each layer to be formed is controlled to <=500Å, and a layer consisting essentially of >=1 kinds among such ferromagnetic metals as Ni, Co and Fe and and a layer consisting essentially of >=1 kinds among such nonmagnetic metals as Cu, Au, Pt, Ag and Sn are laminated.
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