| 摘要 |
<p>PROBLEM TO BE SOLVED: To bond the outer lead of a tape carrier package well to an electrode part formed on a circuit board without complicating the design process and the production process of the circuit board by bonding them through a conductive bonding member mixed with a granular spacer. SOLUTION: The electrode lead (outer lead) 6 of a TAB chip (tape carrier package) 5 is bonded to an electrode part 2 formed on a circuit board 1 through cream solder (conductive bonding member) 4 mixed with a granular spacer of insulating or conducting material in the order of 100μm. The granular spacer in the cream solder 4 prevents the cream solder 4 from being jutted out by the undue pushing force of a bonding tool at the time of thermal fusion and also prevents formation of solder bridge between the electrode parts 2. According to the structure, formation of solder bridge between the electrode parts 2 can be prevented without complicating the production process and the design process.</p> |
