发明名称 |
CVD TUNGSTEN DEPOSITION ON OXIDE SUBSTRATES |
摘要 |
The present invention discloses a method for depositing a conductor, such as tungsten (W), onto a substrate. The method generally includes depositing an amorphous silicon layer on an oxide substrate and then depositing a conductive film, such as tungsten, thereover. The silicon is believed to provide a nucleation surface for subsequent metal deposition and to provide protection for the substrate from the deleterious effects of the surface reaction between silicon and tungsten hexafluoride.
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申请公布号 |
WO0006795(A1) |
申请公布日期 |
2000.02.10 |
申请号 |
WO1999US16450 |
申请日期 |
1999.07.22 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
MAHAJANI, MAITREYEE;GHANAYEM, STEVE, G. |
分类号 |
C23C16/02;C23C16/14;H01L21/285;H01L21/768;(IPC1-7):C23C16/14 |
主分类号 |
C23C16/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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