发明名称 CVD TUNGSTEN DEPOSITION ON OXIDE SUBSTRATES
摘要 The present invention discloses a method for depositing a conductor, such as tungsten (W), onto a substrate. The method generally includes depositing an amorphous silicon layer on an oxide substrate and then depositing a conductive film, such as tungsten, thereover. The silicon is believed to provide a nucleation surface for subsequent metal deposition and to provide protection for the substrate from the deleterious effects of the surface reaction between silicon and tungsten hexafluoride.
申请公布号 WO0006795(A1) 申请公布日期 2000.02.10
申请号 WO1999US16450 申请日期 1999.07.22
申请人 APPLIED MATERIALS, INC. 发明人 MAHAJANI, MAITREYEE;GHANAYEM, STEVE, G.
分类号 C23C16/02;C23C16/14;H01L21/285;H01L21/768;(IPC1-7):C23C16/14 主分类号 C23C16/02
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