发明名称 |
HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH |
摘要 |
<p>A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm<2> or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices. <IMAGE></p> |
申请公布号 |
EP0984051(A1) |
申请公布日期 |
2000.03.08 |
申请号 |
EP19980921865 |
申请日期 |
1998.05.28 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
SAKATA, TOICHI;NISHIZAWA, HIROSHI;HIRAI, KEIZO;SUZUKI, KENJI |
分类号 |
C08J3/24;C08L79/08;C09J9/00;C09J179/08;H01L21/52;H01L23/29;H01L23/31;H01L23/495;(IPC1-7):C09J9/00;H01L23/28 |
主分类号 |
C08J3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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