| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for printed circuit board having excellent heat-resistance, processability and adhesivity while keeping sufficiently high mechanical strength and exhibiting low dielectric constant especially in a high-frequency range. SOLUTION: The objective adhesive composition for printed circuit board contains a fumaric acid ester. More particularly, the composition is composed of (A) a fumaric acid ester, (B) a diallyl oligomer, (C) a vinyl aromatic compound, (D) a vinyl aromatic block-copolymer and (E) a curing agent.
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