发明名称 TIN ELECTROLYTIC COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an electrolytic composition for tin plating. SOLUTION: This electrolytic composition for tin plating or a tin alloy plating on a substrate contains one or more tin compounds, one or more acidic electrolytes, one or more alkylene oxide compounds, one or more polyalkylene glycols and, optionally one or more additives.
申请公布号 JP2001323392(A) 申请公布日期 2001.11.22
申请号 JP20010103100 申请日期 2001.04.02
申请人 SHIPLEY CO LLC 发明人 BROWN NEIL D;FEDERMAN GEORGE A;CHIRAFISI ANGELO B;LAI GREGORY
分类号 C25D3/30;C25D3/32;C25D3/56;C25D3/60;C25D5/26;(IPC1-7):C25D3/32 主分类号 C25D3/30
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