| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and its manufacturing method with a method and a structure more simplified than the conventional art and higher reliability. SOLUTION: The electronic component includes an insulating substrate 10; one or more capacitors 12, 13 and an inductor 14 directly provided on the insulating substrate 10; wiring 15, 16, 17 for connecting the capacitors and the inductor from the upper direction of them; and external connecting pad parts 18-21 formed, on the insulating substrate 10, from conductors of the same kind as the wiring. For example, the electronic component further includes an insulating film for covering the capacitors and the inductor and on this insulating film, the wiring is provided. COPYRIGHT: (C)2006,JPO&NCIPI |
