| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be miniaturized and which has high and stabilized cooling capability. SOLUTION: A semiconductor module is placed on a heat sink having a recess, cooling liquid is supplied to a passage surrounded with the backside of the recess and the semiconductor module, a partition having a duct surface substantially parallel to the backside of the semiconductor module is provided on the bottom of the recess, and the cooling liquid supplied from an aqueduct along the partial side surface of the partition is ejected through the aqueduct formed along the other side surface of the partition through the duct part formed between the duct side and this semiconductor module. A bubble ejection hole for ejecting the bubble formed in the passage is provided in the heat sink. COPYRIGHT: (C)2006,JPO&NCIPI |
