Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

摘要

Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other; that is, the die attach sides of the package substrates face one another, and the "land" sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. In some embodiments the first package is a chip scale package, and the second package is a land grid array package. Also, methods for making such stacked packages assemblies include steps of providing a cavity molded LGA package, preferably tested as "good"; applying an adhesive onto the surface of the mold cap of the LGA package; providing a singulated CSP; inverting the CSP and placing the inverted CSP onto the adhesive on the LGA mold cap; curing the adhesive; performing a plasma clean; wire bonding to form z-interconnection between the die attach side of the LGA and the land side of the CSP; performing a plasma clean; performing a molding operation to enclose the die attach side of the LGA, the z-interconnection wire bonds and wire loops, the edges of the CSP, and the marginal area on the land side of the CSP, leaving exposed the land side of the LGA substrate and an area of the land side of the CSP substrate located within a marginal area; attaching second level interconnect solder balls to sites on exposed area of the CSP substrate; and (where the LGA package was provided in a strip or array) saw singulating to complete the assembly. In some embodiments one or more additional components are stacked over the land side of the LGA substrate.