| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive resin composition having heat resistance and exhibiting good pattern forming accuracy by a photographic process when a resin layer is formed, and also to provide a solder resist using the same. <P>SOLUTION: The photosensitive resin composition contains a photopolymerizable unsaturated compound (A) obtained by reacting a compound (a) having at least two phenolic hydroxyl groups, a compound (b) having at least one glycidyl ether group and at least one acryloyl group or methacryloyl group, and a dicarboxylic acid or anhydrous carboxylic acid compound (c), and a polyfunctional dihydroxybenzoxazine compound (B). The photosensitive solder resist comprises the photosensitive resin composition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
