发明名称
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device, a circuit substrate provided with the semiconductor device and an electro-optical device capable of securing accuracy at the position of a disposition at the time of mounting and capable of improving the strength of a junction to a temperature cycle added after the mounting is performed. SOLUTION: In the semiconductor device having an electrode 101 that electrically contacts a conductive layer which is a mounted object and a structure 102 which more protrudes than the electrode 101 and is shaped into a predetermined pattern formed of a resin, the structure 102 is provided with a recess 106 or a salient corresponding to the recess or the salient which is the mounted object. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP3979368(B2) 申请公布日期 2007.09.19
申请号 JP20030319981 申请日期 2003.09.11
申请人 发明人
分类号 G02F1/1345;H01L21/60;H01L23/12;H01L51/50;H05B33/14;H05K3/34 主分类号 G02F1/1345
代理机构 代理人
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