| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the influence of vibration to the securing of throughput and exposure operation. <P>SOLUTION: Since a measurement section 110 for measuring the position information of an alignment mark formed on a wafer W is arranged outside an exposure system body 10, the position information of the alignment mark formed on the wafer can be measured at the measurement section in parallel with the exposure of the wafer at the exposure system body. With this sort of parallel processing, throughput can be secured that is equal to or more than that of an exposure system, or the like of a twin wafer stage, and the measurement section and the exposure system body are separated easily in terms of vibration, thus reliably reducing vibration factors to the exposure system body caused by the operation of the measurement section. <P>COPYRIGHT: (C)2008,JPO&INPIT |
