| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a structure preventing an increase of chip size per chip and obtaining adhesive strength. <P>SOLUTION: By making the adhesive surfaces in a sensor chip 1 and a protective cap 2 to be projected-recessed surfaces 1c and 2b, the adhesive area is increased compared with that in the case of a mere plane. Thereby, the large adhesive surface can be obtained without increasing the chip size of the sensor chip 1 and the size of the protective cap 2, so as to enhance the adhesive strength between the sensor chip 1 and the protective cap 2. Moreover, a heat-resistant adhesive 3 can enter the recess of the projected-recessed surfaces 1c and 2b that are formed in the sensor chip 1 and the protective cap 2, so as to suppress the extrusion of the heat-resistant adhesive 3 to the sensor structure 1a side. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
