| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow device capable of conducting excellent soldering by keeping the temperature distribution of a substrate constant, capable of sufficiently handling even small production and irregular production interval and capable of realizing miniaturization, efficiency improvement, equipment cost reduction and energy conservation. SOLUTION: In the reflow device, a control means controls the carrying of the substrate so that the substrate is passed through a preheating section and a main heating section for a preset heating time while continuing the carrying of the substrate by a carrier means. COPYRIGHT: (C)2008,JPO&INPIT |
