| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation characteristics of a light emitting device where a light-emitting element is fitted to a printed board, for improved light- emission efficiency and reduction in size. SOLUTION: A Cu pattern coated with Ni is formed on a metal substrate 11, over which a lighl-emitting element 15 is mounted. As Ni is excellent in corrosion-resistance and light reflectivity, a substrate surface itself is utilized as a reflection plate. A lens is formed at each light-emitting element for improved emission efficiency. |
