| 发明名称 |
CIRCUIT MODULE HAVING SURFACE-MOUNT PADS ON A LATERAL SURFACE FOR CONNECTING WITH A CIRCUIT BOARD |
| 摘要 |
A circuit module for connecting to a circuit board is disclosed, the circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface, a bottom surface and a lateral surface connecting the top surface and bottom surface, wherein at least one electrical component is disposed on the top or bottom surface and a plurality of surface-mount pads are disposed on the lateral surface of the substrate for electrically connecting to corresponding pads on the circuit board. |
| 申请公布号 |
US2016227649(A1) |
申请公布日期 |
2016.08.04 |
| 申请号 |
US201514614401 |
申请日期 |
2015.02.04 |
| 申请人 |
CYNTEC CO., LTD. |
发明人 |
LU BAU-RU |
| 分类号 |
H05K1/11;H05K1/18 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface, a bottom surface and a lateral surface connecting the top surface and bottom surface, wherein at least one electrical component is disposed on the top or bottom surface and a plurality of surface-mount pads are disposed on the lateral surface of the substrate for electrically connecting to corresponding pads on the circuit board. |
| 地址 |
Hsinchu TW |
