发明名称 |
Silicon carbide semiconductor device and method for manufacturing same |
摘要 |
A method for manufacturing a silicon carbide semiconductor device includes the following steps. A silicon carbide substrate is prepared. A first heating step of heating the silicon carbide substrate in an atmosphere of oxygen is performed. A second heating step of heating the silicon carbide substrate to a temperature of 1300° C. or more and 1500° C. or less in an atmosphere of gas containing nitrogen atoms or phosphorus atoms is performed after the first heating step. A third heating step of heating the silicon carbide substrate in an atmosphere of a first inert gas is performed after the second heating step. Thus, the silicon carbide semiconductor device in which threshold voltage variation is small, and a method for manufacturing the same can be provided. |
申请公布号 |
US9425263(B2) |
申请公布日期 |
2016.08.23 |
申请号 |
US201514803868 |
申请日期 |
2015.07.20 |
申请人 |
Sumitomo Electric Industries, Ltd. |
发明人 |
Hiyoshi Toru;Uchida Kosuke;Masuda Takeyoshi |
分类号 |
H01L21/20;H01L29/06;H01L29/16;H01L29/51;H01L21/263;H01L21/04;H01L29/66;H01L29/739;H01L29/78;H01L29/34;H01L29/04 |
主分类号 |
H01L21/20 |
代理机构 |
Venable LLP |
代理人 |
Venable LLP ;Sartori Michael A. |
主权项 |
1. A silicon carbide semiconductor device comprising:
a silicon carbide substrate; an oxide film arranged in contact with said silicon carbide substrate; a gate electrode arranged in contact with said oxide film such that said gate oxide film is interposed between said gate electrode and said silicon carbide substrate; and a first electrode and a second electrode arranged in contact with said silicon carbide substrate, said first electrode and said second electrode being configured such that a current flowing between said first electrode and said second electrode can be controlled by a gate voltage applied to said gate electrode, the difference between a first threshold voltage of said silicon carbide semiconductor device that is measured for the first time and a second threshold voltage of said silicon carbide semiconductor device that is measured after stress has been applied to said silicon carbide semiconductor device continuously for 1000 hours is within ±0.2 V, the application of said stress being applying said gate voltage of 45 kHz varying from −5 V to +15 V to said gate electrode, with the voltage of said first electrode being 0 V and the voltage of said second electrode being 0 V. |
地址 |
Osaka-shi JP |