发明名称 MULTILAYER-STACKED RESISTIVE RANDOM ACCESS MEMORY DEVICE
摘要 A multilayer-stacked resistive random access memory device includes: first and second electrode layers; a resistive oxide layer which is electrically coupled to the first and second electrode layers, which exhibits resistive switching characteristics and which includes a metal oxide containing a first metal selected from the group consisting of W, Ti, Zr, Sn, Ta, Ni, Ag, Cu, Co, Hf, Ru, Mo, Cr, Fe, Al, and combinations thereof; and a sulfide layer contacting the resistive oxide layer and including a metal sulfide that contains a second metal that is the same as the first metal.
申请公布号 US2016240779(A1) 申请公布日期 2016.08.18
申请号 US201514736958 申请日期 2015.06.11
申请人 National Tsing Hua University 发明人 YEW Tri-Rung;HUNG Ying-Chan;WANG Tsang-Hsuan;CHANG Pin
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A multilayer-stacked resistive random access memory device comprising: first and second electrode layers; a resistive oxide layer which is electrically coupled to said first and second electrode layers, which exhibits resistive switching characteristics, and which includes a first metal oxide containing a first metal selected from the group consisting of W, Ti, Zr, Sn, Ta, Ni, Ag, Co, Hf, Ru, Mo, Cr, Fe, Al, and combinations thereof; a sulfide layer contacting said resistive oxide layer, disposed between said resistive oxide layer and said first electrode layer, and including a metal sulfide that contains a second metal that is the same as said first metal, and a conductive oxide layer disposed between said resistive oxide layer and said second electrode layer; wherein said sulfide layer cooperates with said resistive oxide layer to form a p-n junction therebetween.
地址 Hsinchu City TW