Semiconductor device and method of manufacturing semiconductor device

摘要

A semiconductor device incorporating a heat spreader and improved to inhibit dielectric breakdown is provided. The semiconductor device has an electrically conductive heat spreader having a bottom surface, a sheet member having a front surface and a back surface electrically insulated from each other, IGBTs and diodes fixed on the heat spreader and electrically connected thereto, and a molding resin. The front surface contacts with the bottom surface and has a peripheral portion jutting out from edges thereof. The molding resin encapsulates the front surface of the sheet member, the heat spreader and the semiconductor elements. At least part of the back surface of the sheet member is exposed out of the molding resin. The heat spreader has, at a corner of its bottom surface, corner portions having a beveled shape or a curved-surface shape as seen in plan and having a rectangular shape as seen in section.

主权项

1. A semiconductor device comprising:
a heat spreader including a bottom surface and being electrically conductive; a sheet member including a front surface and a back surface, the front and back surfaces electrically insulated from each other, the front surface contacting the bottom surface of the heat spreader, the sheet member including a peripheral portion that juts out from an edge of the bottom surface; a semiconductor element fixed on the heat spreader and electrically connected to the heat spreader; and an encapsulation resin body in which the front surface of the sheet member, the heat spreader, and the semiconductor element are encapsulated, and at least a portion of the back surface of the sheet member exposed from the encapsulation resin body; wherein the heat spreader includes a corner portion at a corner of the bottom surface, the corner portion includes a C-beveled shape as seen in the plan view, the corner portion is rectangular as seen in the section of the heat spreader.