| 发明名称 |
Semiconductor device and method of forming the same |
| 摘要 |
A semiconductor device includes a wiring board; a stack of semiconductor chips disposed over the wiring board, each of the semiconductor chip comprising via electrodes, the semiconductor chips being electrically coupled through the via electrodes to each other, the semiconductor chips being electrically coupled through the via electrodes to the wiring board; a first seal that seals the stack of semiconductor chips; and a second seal that covers the first seal. The first seal is smaller in elastic modulus than the second seal. |
| 申请公布号 |
US9466546(B2) |
申请公布日期 |
2016.10.11 |
| 申请号 |
US201113293769 |
申请日期 |
2011.11.10 |
| 申请人 |
PS4 Luxco S.a.r.l. |
发明人 |
Hatakeyama Koichi;Watanabe Mitsuhisa;Kusanagi Keiyo |
| 分类号 |
H01L23/31;H01L21/56;H01L21/683;H01L23/00;H01L25/065;H01L23/48 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a wiring board; a stack of semiconductor chips disposed over the wiring board, each of the semiconductor chips including via electrodes, the semiconductor chips being electrically coupled through the via electrodes to each other, the semiconductor chips being electrically coupled through the via electrodes to the wiring board; a first seal that seals the stack of semiconductor chips and covers a top surface of a topmost semiconductor chip in the stack of semiconductor chips, the stack of semiconductor chips being without a semiconductor chip stacked on top of the topmost semiconductor chip; and a second seal that covers the first seal, wherein the first seal is smaller in elastic modulus than the second seal, and wherein the first seal covers an entire top portion and outer sides of the stack of semiconductor chips. |
| 地址 |
Luxembourg LU |
