Light emitting member having a wiring board with through hole exposing a light emitting semiconductor element with a light reflecting member covering a peripheral wall portion of the through hole

摘要

A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.

主权项

1. A light emitting device comprising:
a heat dissipation board; a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole; a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board; and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being parallel to a side surface of the semiconductor light emitting element, wherein a surface of the light reflecting member includes an inclined surface, wherein fine particles of a material having high light reflectivity are dispersed in the light reflecting member.