Integrated electronic package and method of fabrication

摘要

An integrated electronic package includes an integrated circuit (IC) die and conductive discrete components. Electrical interconnects are formed directly between bond pads on an active side of the IC die and contacts on the conductive discrete components without an intervening lead frame. The IC die, conductive discrete components and electrical interconnects are embedded in an encapsulation material. Contact surfaces of at least some of the conductive discrete components are exposed from the encapsulation material and can be attached to a printed circuit board in order to mount the integrated electronic package to the printed circuit board.

主权项

1. An integrated electronic package comprising:
an integrated circuit (IC) die having an active side at which bond pads are located, and a back side opposing said active side; a surface mount component having first and second electrically conductive contacts separated from one another by a body portion spanning between said first and second contacts, wherein said surface mount component comprises at least one of a resistor, a capacitor, an inductor, and a diode; a first electrical interconnect formed directly between one of said bond pads and said first contact without an intervening lead frame; a second electrical interconnect formed directly between a second one of said bond pads and said second contact; and encapsulation material formed over said IC die, said surface mount component, and said electrical interconnect, wherein said first contact and said body portion of said surface mount component are embedded within said encapsulation material and a contact surface of said second contact is exposed from said encapsulation material.