Semiconductor package with small gate clip and assembly method

摘要

A method of manufacturing a semiconductor package having a small gate clip is disclosed. A first and second semiconductor chips, each of which includes a source electrode and a gate electrode at a top surface, are attached on two adjacent lead frame units of a lead frame such that the lead frame unit with the first chip formed thereon is rotated 180 degrees in relation to the other lead frame unit with the second semiconductor chip formed thereon. A first and second clip sets are mounted on the first and second semiconductor chips, wherein the first clip set is connected to the gate electrode of the first chip, the source electrode of the second chip, and their corresponding leads and the second clip set is connected to the gate electrode of the second chip, the source electrode of the first chip and their corresponding leads.

主权项

1. A clip frame comprising:
a first tie bar; a second tie bar; a first clip set comprising a first gate clip connected to a first source clip; a second clip set comprising a second gate clip connected to a second source clip; wherein the first and second clip sets constituting a rotational symmetry of order 2 image of each other; wherein each gate clip comprises a gate electrode contact area and a gate lead contact area; each source clip comprises a source electrode contact area and a source lead contact area; and wherein each source lead contact area and each gate lead contact area are located at a first height; each source electrode contact area and each gate electrode contact area are located at a second height; the first height is lower than the second height; and the first and second tie bars are higher than the second height.