发明名称 LAMINATION APPARATUS AND LAMINATION METHOD USING THE SAME
摘要 Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.
申请公布号 US2016318293(A1) 申请公布日期 2016.11.03
申请号 US201615139996 申请日期 2016.04.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM Do Hyung;HAN Dong-Hee;KIM Do-Wan;KIM Byeong-Cheol;KIM Hak Rae;SUNG Jung Hun;WOO Sung-Gwan;JANG Kyung Woon;CHUNG Chang Kyu;HONG Kyoung Hern;HWANG Sung-Ju
分类号 B32B37/14;B32B37/12 主分类号 B32B37/14
代理机构 代理人
主权项 1. A lamination apparatus comprising: a guide member, on which a substrate is mountable, the guide member having a width greater than a width of the substrate and bendable; a first jig on which a cover window is mountable, wherein the cover window includes: a rear surface on which the substrate is positioned, anda curved surface portion which curvature center is positioned behind the rear surface of the curved surface portion; a second jig to seat the guide member thereon; and an interference member to interfere with the guide member while the first jig and the second jig approach each other, wherein, while the first jig and second jig approach each other, the interference member interferes with the guide member and the guide member bends due to the interference for positioning the substrate to the rear surface of the cover window.
地址 Suwon-si KR