| 摘要 |
The purpose of the present invention is to ensure, with a simple structure, a holding area to be held by a holding tool in the case of assembling a semiconductor module (1) to a device, said semiconductor module (1) being configured by mounting a semiconductor element and leading out many external connection terminals (302, 303, 304) from the sides of a molded resin section (301). The semiconductor module is configured such that holding side sections (305, 306) are provided at least at two facing areas of the corner sections, each of which is configured from adjacent sides of the molded resin section (301). |
