| 摘要 |
PURPOSE:To increase the adhesion between a copper circuit and resin, and prevent halo phenomena by a method wherein copper oxide is formed by oxidizing the copper circuit surface of a circuit board for an inner layer, and then the copper oxide is reduced by making reducing gas react with the copper oxide surface. CONSTITUTION:Copper oxide is formed on the surface of a circuit by oxidizing the copper circuit surface of a circuit board for an inner layer. The copper oxide is reduced to be cuprous oxide or metal copper while surface irregularity is left as it is, by making reducing gas react with the copper oxide. Thereby fine protrusions are formed on the copper circuit surface, and the surface can be roughened, so that the adhesion between the copper circuit and resin can be increased. Further the copper oxide is reduced, and therefore the copper oxide is turned into a state that it is bard to be dissolved in acid. Hence it can be prevented that the copper oxide formed on the copper circuit is dissolved in acid at the time of plating treatment, and halo phenomena is generated. |
