LED PACKAGE, LIGHT-EMITTING DEVICE USING IT, AND METHOD OF MANUFACTURING LED PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a LED package which has a high wiring reliability and simplifies the process.

SOLUTION: The LED package manufacturing method comprises a step of preparing a (100) silicon substrate having insulation films on the front and back surfaces; forming resist patterns on the insulation films; partly etching the insulation films to form etching masks on the front and back surfaces; applying an anisotropic etching depending on the plane orientation to the substrate to form a horn with taking the (100) plane as its bottom side and four (111) planes as its inclined side walls, and a through-hole gradually narrowed inward from the front and back surfaces of the substrate with restricted parts formed in the middle of the substrate, with taking the (111) plane as its side wall; and mounting a LED chip on the horn bottom side.

COPYRIGHT: (C)2008,JPO&INPIT