| 摘要 |
<p>PURPOSE: To obtain an IC card low in cost having high water resistance and high reliability whose adhesive does not project out of the periphery of a package. CONSTITUTION: An IC card consists of a plurality of frame bodies 4 and 5 which are connected at connecting faces 4b and 5b of a peripheral edge so as to form an integral package and an IC card module 3 housed in the package. The package comprises an adhesive 13b which is arranged in between the connecting faces 4b, 5b and surrounds the IC card module 3, adhesive bypass clearances B, C formed in between the connecting faces 4b, 5b outside the adhesive 13b, and sealing structures 4e, 5e arranged on the connecting faces 4b, 5b outside the adhesive bypass clearances B and C.</p> |
