| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin packaged semiconductor device with which the heat generated when the device is in operation can be radiated to a substrate, by making the most of the characteristics of a heat radiating plate without impairing the mounting stability to a substrate, and to provide a manufacturing method of the above-mentioned semiconductor device. SOLUTION: A resin packaged semiconductor device 2 is provided with a semiconductor chip, a plurality of inner leads which are electrically conducted to the semiconductor chip, a resin package 22 with which the semiconductor chip and the inner leads are enveloped, a plurality of outer leads 23 extending to outside of the resin package 22 connected to the inner lead 21, and a heat radiating plate 24 which is incorporated into the resin package 22 in such a manner that a part of the heat radiating part 24 extended to outside of the resin package 22. Slits 26 and holes are formed on the resin package 22.</p> |
