| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the efficiency of a product assembling process by providing, on one side of a polyimide tape, with a wiring pattern arranging with ball terminals through an inner lead and, on the other side thereof, with a stress buffer layer for absorbing thermal stress between a semiconductor chip and a printed board along with an adhesive. SOLUTION: A wiring pattern 4 is formed on one side of a long polyimide tape 2 through an adhesive 14 and a land 6 is formed on the surface thereof by opening a solder resist 5 circularly in order to form a solder ball terminal 9. A stress butter layer 3 of an elastomer is formed on the other side through an adhesive 7 and applied with an adhesive 12 for bonding a semiconductor chip 1. Furthermore, an inner lead 10 extending from the wiring pattern 4 is bonded to the semiconductor chip 1 side. Since the semiconductor chip 1 can be mounted without applying an adhesive, the mounting efficiency is enhanced.</p> |
