| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device where a circuit configuration part analysis is difficult and reproduction or imitation of the device and alteration of information by other persons are prevented. SOLUTION: A semiconductor device consists of a semiconductor substrate 1, where a circuit main part 1a including a prescribed active element and the like is formed on a silicon substrate, wiring 2 for transmitting an input signal from the outside or an output signal to the outside to the active element and the like, an opening 3 for inputting or outputting a signal from (or to) the outside of the wiring 2, an insulation protection film 4 for protecting the part of the lower layer from the wiring 2, a conductive metal film 5 that is arranged on the circuit main part 1a, and an aluminum oxide film 6 that is arranged so as to cover the conductive metal film 5.</p> |
