| 摘要 |
<p>PROBLEM TO BE SOLVED: To decrease defects such as blurs and bleeding at printing of an outer layer conductor by eliminating a step difference on a ceramic tape as the uppermost layer of a multilayer after being stacked to obtain a flat surface. SOLUTION: In this method for manufacturing a multilayer ceramic wiring board, a ceramic tape 1 having a conductor 3 formed thereon is laminated, and subsequently the tape is burned integrally. In this case, the method includes the steps of forming a conductor 4 on the ceramic tape 1, forming an insulating layer 5 which has nearly the same thickness as that of the conductor 4 and surrounds the periphery of the conductor 4, and laminating the ceramic tape 1 having the conductor 4 and an insulating layer 5 formed thereon.</p> |
