| 摘要 |
PURPOSE: A structure of a lamp-type surface mounted LED(light emitting diode) is provided to simplify a fabricating process and reduce fabricating cost by optimizing the characteristic of an LED in molding a frame having at least one lead by a capsule method. CONSTITUTION: At least one leadframe has a reflection cup. A die-bonded LED is prepared. The reflection cup of the leadframe is connected to the LED by a gold wire(4). A molding cup electrically connects the gold wire to be filled with transparent epoxy resin. A frame settlement part has a bonded chip in the molding cup. A package forming part hardens a frame together with molding resin in the frame settlement part to form a package. After the package is formed in the package forming part, a trimming process and a forming process are performed to singulate a surface mounted package part. |
