| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light source device which is excellent in both heat-resistant and heat-dissipating properties. <P>SOLUTION: The light source device 1 uses a wiring board 10 that is composed of a metal base board 11 which is provided with inorganic material insulating layers 11b each formed on its front and rear surface, and a wiring pattern 13 formed on the insulating layer 11b. A U-shaped depressed holder 11a is provided to the wiring board 10, and a semiconductor light emitting element 20 is mounted on a die bonding pad 50 formed on the flat plane of the holder 11a. An electrode on the upper surface 20a of the semiconductor light emitting element 20 is connected to the wiring pattern 13 with a conductor wire 21. A thermal via 12 composed of a through-hole 12a and a metal conductor 12b filling the through-hole 12a is provided at the mounting position of the semiconductor light emitting element 20. The U-shaped depressed holder 11a is filled up with light-transmitting sealing material 30; and a light output part 40 is equipped with an annular tapered curved surface and fitted to the U-shaped depressed holder 11a, and is fixed on the sealing material 30. <P>COPYRIGHT: (C)2008,JPO&INPIT |
