| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which can suppress an influence of stress on the electronic apparatus due to warpage of a substrate and is applicable even if lead-free solder is used for mounting, in the electronic apparatus wherein a substrate with electronic parts mounted is fixed to a supporting body by means of a fixing means. SOLUTION: A seat 12 is projected at a position for fixing a metal substrate 13 in a heat sink 11 constituting an electronic apparatus. The metal substrate 13 is fixed onto the heat sink 11 by screws 15 at four positions not on a straight line. Tightening positions by the screws 15 are set outside the arrangement position of heat generators 17 which are mounted in the central part in the lengthwise direction of the metal substrate 13. The heat generators 17 are mounted in a range surrounded by a virtual straight line L connecting the tightening positions of the screws 15, and non-heat generators 18 are mounted outside a range surrounded by a virtual straight line L connecting tightening positions of the screws 15. COPYRIGHT: (C)2007,JPO&INPIT
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