METALLIC PACKAGE, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a metal package using a metal base facilitating downsizing of a lead terminal and which is highly advantageous when a plurality of lead terminals are needed. SOLUTION: The metal base 10 with a cylindrical metal outer ring 12 with a through hole and a lead member 16 sealed air tight by insulating material 14 inside the metal outer ring are used in the metal package. The lead member 16 of the metal base is structured by being provided with conductive patterns for lead 20 and 22 by metallizing on a surface of a ceramic segment 18. Here, the ceramic segment 18 is composed of ceramic material including Al2O3as a main component. The metallizing conductive pattern is executed making use of printing technology by conductive paste to green sheet in a manufacturing process before a sintering process for the ceramic segment 18. COPYRIGHT: (C)2007,JPO&INPIT