| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting module and a manufacturing process thereof to conduct heat energy effectively and quickly to further reduce the temperature of an LED by using a medium that is able to easily conduct both electricity and heat as well as the manufacturing process. <P>SOLUTION: The light emitting module includes a metal substrate, a mounting base, at least one LED, a printed circuit board, and at least one conductive wire. A first perforation is formed on the metal substrate, and the mounting base is embedded into the first perforation of the metal substrate. The LED(s) is/are die-bonded on the mounting base by a eutectic soldering method via a compound metal. A second perforation is formed on the printed circuit board to expose the LED(s) which is/are die-bonded on the mounting base, and further allows the printed circuit board to stick on the metal substrate. The conductive wires are used to connect electrically the LED(s) to the printed circuit board. <P>COPYRIGHT: (C)2008,JPO&INPIT |
