SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, SEMICONDUCTOR CHIP MOUNTING BODY, SEMICONDUCTOR CHIP STACKED MODULE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR CHIP MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To reduce thickness of a semiconductor chip mounting, while ensuring alignment at stacking. SOLUTION: There is provided a semiconductor chip mounting substrate 20, including a substrate 122 on which a mounting region 21 for mounting a semiconductor chip 121 and a connection region 123 for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks 125 for alignment at the time of stacking which are provided around or in the connection region on the substrate, wherein a reinforcing member 11 as a reinforcing region for reinforcing a portion between the plurality of alignment marks 125 is provided on the substrate 20. COPYRIGHT: (C)2008,JPO&INPIT