| 摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of voids by moderating the charge speed difference of sealing resin, when a plurality of semiconductor devices are sealed in a lump by mold forming. SOLUTION: A semiconductor device 4 is mounted to a substrate frame 1 having a plurality of device formation regions 2. In the region except an element mounting region of the substrate frame 1, a protruded portion 7 to control the flow of the sealing resin is formed. The plurality of semiconductor devices 4 are sealed in a lump by charging the sealing resin in a mold block 8 in which the substrate frame 1 is arranged. Individualized pieces of the semiconductor device are manufactured by cutting the substrate frame 1 together with the sealing resin 6. COPYRIGHT: (C)2009,JPO&INPIT
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