| 摘要 |
PROBLEM TO BE SOLVED: To provide a baking jig for a terminal electrode film in a chip-type electronic component that can evenly bake a terminal electrode film, which is low in cost, comparatively robust, and enabled in effective heating. SOLUTION: In the baking jig for a terminal electrode film in a chip-type electronic component, the bottom surface of a frame 1 is made to be a multi-porous surface, the frame 1 formed of a refractory metal and formed into a box with its top surface open for a multistage pile, and a metal gauze 6 formed of a refractory metal is arranged into this frame so as to contact with the bottom surface a plurality of cut-out windows 5 for ventilation are installed in a row at a rising part 4 of each side surface of the frame, the top side of the rising part of each side surface of the frame is around in around the metal gauze, and the end of metal gauze 6a is fixed 7 to the metal gauze at this side of the around part in the cut-out windows. COPYRIGHT: (C)2009,JPO&INPIT
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