| 摘要 |
An apparatus and a method for accurately determining if a substrate is properly retained by a substrate-retaining mechanism, lowering the manufacturing cost, and instantly detecting any fracture of the substrate during treatment are disclosed. The apparatus includes a substrate-retaining mechanism to retain a wafer, a treatment liquid supply mechanism to supply a treatment liquid to the wafer, and a rotatable cup adapted to rotate as an integral unit with the substrate-retaining mechanism while covering the outer peripheral portion of the wafer. The substrate-retaining mechanism has a retaining member. A second end of the retaining member is in the upper position when a first end of the retaining member retains a wafer, or in the lower position when the first end is retaining no wafer. A touch sensor is arranged below the second end of the retaining member so that, when the second end is in the lower position, it can touch the second end.
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