| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for forming a semiconductor wafer protection film, which can form a protection film made of an ultraviolet curable resin with a uniform thickness on a surface of a semiconductor wafer. SOLUTION: An apparatus for forming a semiconductor wafer protection film is provided with: an apparatus base and a surface plate which have apertures penetrating vertically and allowing ultraviolet light to pass through; a light reflector which is attached to a lower section of the surface plate and reflects ultraviolet light upward; an ultraviolet light irradiation means which is attached to a lower section of the light reflector and makes ultraviolet light irradiate upward; a lift member which is provided above the surface plate so as to be capable of moving up/down; an ultraviolet transmitting pressure receiving member which is attached to an upper surface of the surface plate so as to cover the apertures and has a flat upper surface on which a semiconductor wafer can be placed; a pressurizing member which is positioned on a lower side of the lift member, attached to the lift member through an angle adjusting means so as to face the pressure-receiving member, and has a flat lower surface; and an electric cylinder for moving up/down the lift member. COPYRIGHT: (C)2010,JPO&INPIT |
