发明名称 Exposure apparatus and device manufacturing method
摘要 An exposure apparatus comprises an original stage which holds an original, a substrate stage which holds a substrate, and a control unit which controls a measurement process of measuring a relative position between the original and substrate stages, wherein original-side measurement marks including an original-side rough-measurement mark and an original-side fine-measurement mark are formed on the original stage, substrate-side measurement marks including a substrate-side rough-measurement mark and a substrate-side fine-measurement mark are formed on the substrate stage, and the control unit controls the measurement process to perform rough measurement of the relative position between the original and substrate stages using the original-side and the substrate-side rough-measurement marks, correct the relative position between the original and substrate stages based on the result of the rough measurement, and then perform fine measurement of the relative position between the original and substrate stages using the original-side and substrate-side fine-measurement marks.
申请公布号 US9348241(B2) 申请公布日期 2016.05.24
申请号 US200812247294 申请日期 2008.10.08
申请人 Canon Kabushiki Kaisha 发明人 Takenaka Tsutomu
分类号 G03B27/42;G03B27/58;G03B27/62;G03B27/32;G03F9/00;G03F7/20 主分类号 G03B27/42
代理机构 Canon USA, Inc., IP Division 代理人 Canon USA, Inc., IP Division
主权项 1. An exposure apparatus which projects a pattern of an original onto a substrate by a projection optical system to expose the substrate, comprising: an original stage configured to hold the original, wherein an original-side rough-measurement mark and an original-side fine-measurement mark, which have geometric arrangements different from each other, are arranged on said original stage; a substrate stage configured to hold the substrate, wherein a substrate-side rough-measurement mark and a substrate-side fine-measurement mark, which have geometric arrangements different from each other, are formed on said substrate stage; a control unit configured to control a measurement process for measuring a relative position between said original stage and said substrate stage; and a photosensor having a light amount detection range and configured to detect, in a state that the relative position between said original stage and said substrate stage is changed, a first waveform indicating a change in an amount of light transmitted through said original-side rough-measurement mark, the projection optical system, and said substrate-side rough-measurement mark, and a second waveform indicating a change in an amount of light transmitted through said original-side fine-measurement mark, the projection optical system, and said substrate-side fine-measurement mark, and said control unit controls the measurement process to perform rough measurement for measuring the relative position between said original stage and said substrate stage by detecting, using said photosensor, the first waveform while changing the relative position between said original stage and said substrate stage, correct the relative position between said original stage and said substrate stage based on the result of the rough measurement, and then perform fine measurement for measuring the relative position between said original stage and said substrate stage by detecting, using said photosensor, the second waveform while changing the relative position between said original stage and said substrate stage, wherein the geometric arrangements of said original-side rough-measurement mark, said original-side fine-measurement mark, said substrate-side rough-measurement mark and said substrate-side fine-measurement mark are determined so that a maximum value in the first waveform and a maximum value in the second waveform fall within the light amount detection range of said photosensor.
地址 Tokyo JP