发明名称 RF System with an RFIC and Antenna System
摘要 In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
申请公布号 US2016178730(A1) 申请公布日期 2016.06.23
申请号 US201514954395 申请日期 2015.11.30
申请人 Infineon Technologies AG 发明人 Trotta Saverio;Baheti Ashutosh;Nasr Ismail;Huynh Ngoc-Hoa;Niessner Martin Richard
分类号 G01S7/03 主分类号 G01S7/03
代理机构 代理人
主权项 1. A packaged radio frequency (RF) circuit comprising: a radio frequency integrated circuit (RFIC) disposed on a package substrate, the RFIC comprising a plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC different from the first edge; a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC, the receive antenna system comprising a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port; a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC; a first plurality of solder balls disposed on the package substrate adjacent to the RFIC and electrically connected to the RFIC; a second plurality of solder balls disposed on the package substrate adjacent to the receive antenna system, wherein the second plurality of solder balls are electrically floating; and a ground wall disposed on the package substrate between the RFIC and the receive antenna system.
地址 Neubiberg DE