Apparatus and method for double-side polishing of work

摘要

A double-side polishing apparatus for a work according to the present invention includes one or more work thickness measuring devices and a control unit. The double-side polishing method for a work includes the steps of: first polishing for polishing both surfaces of the work; first measurement for measuring the thickness of the work; in the first measurement step, when the thickness of the work is found to reach the predetermined thickness, terminating the orbital motion of the carrier plate; second polishing both surfaces of the work while the carrier plate performs only rotational motion; second measurement for measuring the thickness of the work at predetermined position(s); and determining a time for terminating polishing based on the result of the measurement of the thickness of the work in the second measurement step.

主权项

1. A double-side polishing apparatus for a work, including rotating surface plates having an upper plate and a lower plate, a sun gear provided at a center portion of each rotating surface plate, an internal gear provided at a peripheral portion of each rotating surface plate, and a carrier plate provided between the upper plate and the lower plate provided with one or more openings for holding the work, wherein
the upper plate or the lower plate has one or more holes penetrating from the top surface to the bottom surface of said upper plate or said lower plate, and the double-side polishing apparatus comprises: one or more work thickness measuring devices which can measure the thickness of each work through the one or more holes in real time while double-side polishing the work; and a control unit for synchronizing the rotation of the sun gear and the rotation of the internal gear.