| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module capable of inhibiting influences on a semiconductor chip which is caused by a linear expansion coefficient difference between solder and a post electrode even when the post electrode is covered by an electric joining material such as the solder.SOLUTION: A power semiconductor module includes: an insulation substrate 12 where a semiconductor chip 11 is mounted through a metal plate 16; a printed board 14 where an external connection terminal is disposed on one surface and a post electrode 18 connected with the semiconductor chip is provided on the other surface; and a resin sealing material 24 which encloses the insulation substrate 12 and the printed board 14 therein. The post electrode of the printed board is joined to the semiconductor chip by an electric joining material 19, and a stress relaxing region 26 is formed facing the one surface of the printed board 14. |
