发明名称 導電性組成物及び接合体の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a conductive composition which forms a conductive burned substance having a compact structure that makes voids less likely to occur therein, and to provide a manufacturing method of a junction material using the conductive composition.SOLUTION: A conductive composition is used for forming a conductive burned substance and includes silver oxide particles, a reductant agent, a solvent, and Ag particles. A mass ratio of the silver oxide particles to the Ag particles, Ag-O/Ag, is set to be in a range of 3/7≤Ag-O/Ag≤97/3. It is preferred that an average grain diameter of the Ag particle ranges from 20 nm to 800 nm.
申请公布号 JP5962025(B2) 申请公布日期 2016.08.03
申请号 JP20120011138 申请日期 2012.01.23
申请人 三菱マテリアル株式会社 发明人 仙石 文衣理;西川 仁人;西元 修司;長友 義幸
分类号 H01B1/22;B22F1/00;H01B1/00;H01L21/52 主分类号 H01B1/22
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