发明名称 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
摘要 A semiconductor structure is provided. The semiconductor structure comprises a substrate, stacks, a blocking layer-trapping layer-tunneling layer structure, channel layers, a first insulating material and a dielectric layer. The stacks are formed on the substrate. Each stack comprises a group of alternating conductive strips and insulating strips as well as a first string select line formed on the group. The blocking layer-trapping layer-tunneling layer structure and the channel layers are formed conformally with the stacks. The first insulating material is formed between the stacks and covers portions of the channel layers. The dielectric layer is formed on portions of the channel layers that are not covered by the first insulating material. The semiconductor structure further comprises second string select lines formed between the stacks on the first insulating material, wherein the second string select lines are separated from the channel layers by the dielectric layer.
申请公布号 US2016240551(A1) 申请公布日期 2016.08.18
申请号 US201514620281 申请日期 2015.02.12
申请人 MACRONIX INTERNATIONAL CO., LTD 发明人 Lai Erh-Kun
分类号 H01L27/115 主分类号 H01L27/115
代理机构 代理人
主权项 1. A semiconductor structure, comprising: a substrate; a plurality of stacks formed on the substrate, wherein each of the stacks comprises: a group of alternating conductive strips and insulating strips; and a first string select line formed on the group of the conductive strips and the insulating strips; a blocking layer-trapping layer-tunneling layer structure formed on the stacks, the blocking layer-trapping layer-tunneling layer structure being formed conformally with the stacks; a plurality of channel layers formed on the blocking layer-trapping layer-tunneling layer structure, the channel layers being formed conformally with the stacks; a first insulating material formed between the stacks, the first insulating material covering portions of the channel layers; a dielectric layer formed on portions of the channel layers that are not covered by the first insulating material; and a plurality of second string select lines formed between the stacks on the first insulating material, wherein the second string select lines are separated from the channel layers by the dielectric layer.
地址 Hsinchu TW