INTEGRATED CIRCUIT PACKAGES WITH DUAL-SIDED STACKING STRUCTURE

摘要

An integrated circuit package may include a first integrated circuit die attached to a front surface of a second integrated circuit die. An intermediate layer made of a molding compound is formed to surround the second integrated circuit die in a “fan-out” arrangement while leaving a surface of the second integrated circuit die exposed. Accordingly, a group of via holes is then formed in the intermediate layer and filled with a conductive material. Such a configuration forms a dual-sided stacking structure. The stacking structure may also be applicable for package-on-package packages and fan-out wafer-level chip scale packages, in which the stacking structure is formed between two heterogeneous or homogeneous integrated circuit packages.

主权项

1. An integrated circuit package produced by a process comprising:
providing a first integrated circuit die; providing a second integrated circuit die having opposing first and second surfaces and attaching the first integrated circuit die to the first surface of the second integrated circuit die; forming an intermediate layer on the first integrated circuit die and surrounding the second integrated circuit die; forming a plurality of via holes in the intermediate layer; and filling the plurality of via holes with a conductive material after forming the plurality of via holes.